- plasma etch process
- плазмове травлення
English-Ukrainian dictionary of microelectronics. 2013.
plasma etch process
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Plasma etching — is a form of plasma processing used to fabricate integrated circuits. It involves a high speed stream of glow discharge (plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch species, can be… … Wikipedia
Plasma etcher — A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. Plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine bearing gas, using a high frequency electric field, typically 13.56… … Wikipedia
Advanced Silicon Etch — (ASE) is a deep reactive ion etching (DRIE) technique to rapidly etch deep and high aspect ratio structures in silicon.ASE was pioneered by Surface Technology Systems Plc. (STS) in 1994 in the UK. STS has continued to develop this process with… … Wikipedia
Reactive-ion etching — (RIE) is an etching technology used in microfabrication. It uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High energy ions from the plasma… … Wikipedia
Deep reactive-ion etching — (DRIE) is a highly anisotropic etch process used to create deep penetration, steep sided holes and trenches in wafers, with aspect ratios of 20:1 or more. It was developed for microelectromechanical systems (MEMS), which require these features,… … Wikipedia
Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… … Wikipedia
Photolithography — For earlier uses of photolithography in printing, see Lithography. For the same process applied to metal, see Photochemical machining. Photolithography (or optical lithography ) is a process used in microfabrication to selectively remove parts of … Wikipedia
Dry etching — refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes… … Wikipedia
Surface micromachining — is a process used to produce micromachinery or MEMS.Unlike Bulk micromachining, where a silicon substrate (wafer) is selectively etched to produce structures, surface micromachining is based on the deposition and etching of different structural… … Wikipedia
Copper-based chips — are semiconductor integrated circuits, usually microprocessors, which use copper for interconnections. Since copper is a better conductor than aluminium, chips using this technology can have smaller metal components, and use less energy to pass… … Wikipedia
Copper interconnect — Copper based chips are semiconductor integrated circuits, usually microprocessors, which use copper for interconnections. Since copper is a better conductor than aluminium, chips using this technology can have smaller metal components, and use… … Wikipedia
